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Annealing furnace Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Annealing furnace Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ノリタケカンパニー リミテド エンジニアリング事業部　東京営業所 Tokyo//others
  2. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  3. 伯東 本社 Tokyo//Electronic Components and Semiconductors
  4. 4 アドバンエンジ Niigata//Industrial Machinery
  5. 5 ジェイテクトサーモシステム Nara//Electronic Components and Semiconductors
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Annealing furnace Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Continuous annealing furnace ノリタケカンパニー リミテド エンジニアリング事業部　東京営業所
  2. Centrotherm Ultra High Temperature Bulk Annealing Furnace 伯東 本社
  3. Far Infrared Annealing Furnace ノリタケカンパニー リミテド エンジニアリング事業部　東京営業所
  4. 4 Activation Annealing Furnace "VF-3000H" ジェイテクトサーモシステム
  5. 4 MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2000℃ テルモセラ・ジャパン 本社

Annealing furnace Product List

1～13 item / All 13 items

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Continuous annealing furnace

Continuous annealing furnace

Continuous conveyor type annealing furnace using far infrared heaters and uniform heating method.

This is a continuous conveyor-type annealing furnace that adopts our company's far-infrared heater and uniform heating method. It is ideal for significantly reducing processing time, cutting costs, and inline integration. (Features) ● Fast heating processing Example 1: Automotive headlamp distortion removal after welding 60 minutes ⇒ 5 minutes Example 2: IC tray dimensional stabilization after injection molding 240 minutes ⇒ 6 minutes Example 3: Artificial dialysis machine internal distortion removal after injection molding 120 minutes ⇒ 3 minutes ● Contributes to cost reduction Compared to batch processing: Labor: 1/10 Equipment area: 1/3 Energy cost: 1/2 ● 24-hour automation Can be directly fed from the molding machine Heating processing possible with the same cycle as the molding time Stocker installation possible after extraction ● Clean environment compatible By adding HEPA filters and Teflon belts, it is possible to achieve an internal class below 1000.

  • Heating device
  • Annealing furnace

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Far Infrared Annealing Furnace

Far Infrared Annealing Furnace

Significantly reduce annealing time by effectively utilizing the radiant heat of far infrared heaters.

This system significantly shortens the annealing time by effectively utilizing the radiant heat of far-infrared heaters. It revolutionizes the annealing process for resin molded products. ● Significant reduction in processing time By combining radiant heating from far-infrared and hot air diffusion, processing time can be greatly reduced. Conventional hot air batch furnace: 1-2 hours → Noritake annealing furnace: 3-5 minutes ● Continuous processing with a conveyor system With the reduction in processing time, it becomes a compact continuous furnace. Therefore, it can accommodate continuous processing directly connected to molding machines, increasing production efficiency. ● Improved quality By using a combination of highly adaptable far-infrared heaters and hot air heating, uniform heating can be achieved. Furthermore, continuous processing stabilizes dimensional accuracy. Dimensional accuracy: ±5/100 mm → ±2/100 mm

  • Heating device
  • Annealing furnace

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Small infrared annealing furnace

Small infrared annealing furnace

Continuous heating furnace ideal for annealing small parts such as mobile phone components and automotive parts.

(Specifications) ● Operating temperature: 40 to 230°C ● Electrical capacity: 5 kVA (Breaker 20 A) ● Belt width: 100 mm ● External dimensions: 1220 L × 400 W × 1157 H (mm) ● Furnace length: 700 mm

  • Annealing furnace

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Activation Annealing Furnace "VF-3000H"

Activation Annealing Furnace "VF-3000H"

Usable from R&D to mass production! Vertical furnace with automatic transport compatible with 3 to 6-inch wafers.

The "VF-3000H" is an activation annealing furnace capable of ultra-high temperature processing, suitable for power device manufacturing. It can process mini-batches of 50 wafers and accommodates a wide range of wafer sizes from 3 inches to 6 inches. We have carefully selected the hardware and control systems, making it suitable for both R&D applications and mass production lines. Additionally, we also offer the "VF-5100," which can remove carbon after activation. 【Features】 - Mini-batch processing of 50 wafers, suitable for R&D and mass production lines - Accommodates a wide range of wafer sizes from 3 to 6 inches - The furnace features our unique metal-free structure - Temperature monitoring near the wafer is possible - Standard equipped with N2 load lock *For more details, please refer to the PDF document or feel free to contact us.

  • Annealing furnace

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MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2000℃

MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2000℃

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater materials: ・C/C composite: Φ6 to Φ8 inch ・PG coating high-purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Full automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed control. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

  • Annealing furnace

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Quartz glass high-purity annealing furnace

Quartz glass high-purity annealing furnace

The heat source uses a SiC heater! A high-purity annealing furnace that achieves high clean performance.

The "High Purity Annealing Furnace for Quartz Glass" significantly reduces surface contamination of quartz glass products during the annealing process. By adopting a stainless steel furnace body and high-purity insulation materials, it achieves high cleanliness performance. To accommodate larger diameter and longer products, we are advancing the enlargement of the furnace body and will design it specifically according to customer requests. 【Features】 ■ Achieves high cleanliness performance by using a stainless steel furnace body and high-purity insulation materials. ■ Uses SiC heaters as the heat source to improve temperature distribution performance. ■ Custom designs are possible to match the size of the target products. *For more details, please refer to the PDF materials or feel free to contact us.

  • Annealing furnace

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A must-see for those struggling with annealing processes! Compact far-infrared annealing furnace.

A must-see for those struggling with annealing processes! Compact far-infrared annealing furnace.

By combining a highly responsive far-infrared heater with hot air heating, it is possible to achieve uniform heating!

The "Far Infrared Annealing Furnace" is a revolutionary system that transforms the annealing process of resin molded products. By effectively utilizing the radiant heat from far infrared heaters, the annealing time is significantly reduced. As the processing time decreases, it becomes a compact continuous furnace that can accommodate direct continuous processing with molding machines, thereby increasing production efficiency. 【Features】 ■ Significant reduction in processing time ■ Continuous processing via conveyor system ■ Improved quality *For more details, please refer to the related links or feel free to contact us.

  • Industrial Furnace

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Annealing furnace

Annealing furnace

Adopting a vertical resistance heating method! Compared to door-type models, it significantly reduces the entrapment of foreign objects inside the heater.

The "Annealing Furnace" is a device that arranges four vertical molybdenum disilicide heaters on all sides, capable of heating workpieces at high temperatures and over a wide area. By adopting a vertical resistance heating method, it achieves excellent heat uniformity, minimizes the entrapment of foreign objects in the heater compared to door-type designs, and reduces the footprint of the device. Additionally, it is equipped with a furnace floor lifting mechanism and a furnace floor cart withdrawal mechanism, allowing for safer and easier loading and unloading of workpieces onto the furnace floor. 【Features】 ■ Adopts vertical resistance heating method ■ Uses molybdenum disilicide heaters ■ Capable of heating up to 1800°C in atmospheric conditions ■ Equipped with furnace floor lifting mechanism and furnace floor cart withdrawal mechanism ■ Allows for safer and easier loading and unloading of workpieces onto the furnace floor *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial Furnace

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Centrotherm Ultra High Temperature Bulk Annealing Furnace

Centrotherm Ultra High Temperature Bulk Annealing Furnace

By achieving ultra-high temperature treatment and excellent temperature uniformity, batch processing of boule ingots and wafers is possible, minimizing defects and dislocations.

To improve the yield of wide bandgap semiconductor devices, it is necessary to minimize defects and dislocations caused by stress. One of the methods to achieve this is through ultra-high temperature thermal treatment of semiconductor crystals. The c.CRYSCOO HTA high-temperature annealing furnace has been developed to significantly enhance productivity in the value chain from bulk crystals of wide bandgap semiconductors to devices. With excellent temperature control (maximum temperature of 2200°C), uniformity, and low cross-contamination, the c.CRYSCOO HTA demonstrates superior performance compared to conventional furnaces. It is capable of simultaneously processing more than 10 boule ingots or over 100 unprocessed wafers.

  • Annealing furnace
  • Other semiconductor manufacturing equipment
  • Other metal materials

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Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"

Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater material: ・C/C composite: Φ6 to Φ8 inch ・PG coated high purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2 Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Fully automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed operations. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

  • Annealing furnace
  • Heating device
  • Electric furnace

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Annealing furnace "ANNEAL wafer annealing device"

Annealing furnace "ANNEAL wafer annealing device"

Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with the heating stage installed in the high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

  • Annealing furnace
  • Heating device
  • Electric furnace

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Annealing furnace "Mini-BENCH-prism ultra-high temperature experimental furnace"

Annealing furnace "Mini-BENCH-prism ultra-high temperature experimental furnace"

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples inside a crucible (for solid, powder, granule, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except for temperature adjustment are performed on a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are automatically sequenced with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160mm (*installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples in laboratories and new material research and development, can be easily conducted. The main unit is compact yet suitable for research and development in a wide range of fields.

  • Heating device
  • Annealing furnace
  • Electric furnace

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OEM ODM Contract Manufacturing Case Example: Annealing Furnace

OEM ODM Contract Manufacturing Case Example: Annealing Furnace

Examples of OEM, ODM, and contract manufacturing achievements for annealing furnaces.

Since its establishment, the company has developed and manufactured various devices such as refining machines, continuous weight reduction processing machines, and dyeing machines as a textile machinery manufacturer. In recent years, we have utilized the core technologies cultivated in textile machinery, including dyeing, cleaning, drying, and coating, along with manufacturing technologies for high-pressure vessels, vacuum vessels, and stirring tanks, to engage in small-batch production of diverse products. Moving forward, we will continue to respond to the needs of the times and our customers as a proposal-oriented company. 【Examples of Manufacturing Achievements】 Machine Speed: Regular use 40–120m/min Machine Composition: Furnace body, heating device, circulation fan, blow nozzle, fan heater storage chamber, furnace body front insulation opening and closing device

  • Contract manufacturing

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